The objective of this research is to develop experiments and models for characterizing adhesion over the small surface areas that are encountered in wafer-bonded interconnects and other heterogeneous interfaces.
Research
Research
Characterization of interfacial adhesion over small surface areas
- UT Austin PI: Kenneth M. Liechti
- CO-PIs: Rui Huang
- Funding Source: Semiconductor Research Corporation
- Award: $285K
- Award Date: 1/1/23 for 3 years
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